1.Gold  Plated PI film

2.Gold Plated Conductive Fabric

3.Gold Plated Copper Foil

4.5G Nano Fiber  Antenna  Material

5.Conductive Liquid Crystal Polymer N.W-F.R. Solder able

6.High Density /High Conductivity  N.W.

7.Supper Thin T0.02mm Absorber

5B level bonding strength, 180°Bending：>10 cycles, no crackle on coating  layer.

Supper thick gold coating,  S.R. < 0.05Ω/Sq.  Salt spray test ：24 Hrs.

base material is Rolled temper pure copper foil (>99.9% Copper),  The foil not only function excellent  electricity, thermal conductivity of copper but also performing very good electricity contacting, excellent electro-chemical compatibility, high Corrosion resistance, and very easy for soldering process. 

T 10-100µ, Width Max. 540mm.

upper thick gold coating,  S.R. < 0.05Ω/Sq.  Salt spray test ：24 Hrs.

base material is Rolled temper pure copper foil (>99.9% Copper),  The foil not only function excellent  electricity, thermal conductivity of copper but also performing very good electricity contacting, excellent electro-chemical compatibility, high Corrosion resistance, and very easy for soldering process. 

1.Gold Plated PI film

2.Gold Plated Copper Foil

3.Gold Plated Conductive Fabric4.Gold Plated LCP Nonwoven/F.R,  Sold able with Heat Resistance  > 300°C

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